Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

1. Analytical Modeling. 2. Method of Interfacial Compliance. 3. Thermal Stress in Assemblies with Identical Adherends. 4. Inelastic Strains. 5. Elevated Stand-Off Heights Can Relieve Thermal Stress in Solder Joints. 6. Stress Relief in Assemblies with Inhomogeneous Bonds. 7. Relieving Thermal Stress in Flip-Chip Design. 8. Board Level Dynamic Tests. 9. Accelerated Testing: HALT and FOAT. 10. Probabilistic Design for Reliability of Solder Joint Interconnections. 11. Thermal Stress in Optical Fibers

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• Tecnologia das microondas
• Engenharia electrónica
• Ciência dos materiais

Interfacial Shearing Stress;HALT;Solder Joint;IC Devices;Maximum Interfacial Shearing Stress;finite-element analyses;Interfacial Compliance;solder joint interconnections;Solder Material;inelastic strains;Bonding Layer;Lead Free Solder;Peeling Stress;FEA Data;Mid-cross Section;Assembly Ends;Bonding Material;Shearing Stress Functions;CGA;Assembly Components;Stiff Assembly;Drop Test Conditions;ASME Journal;Peripheral Portion;Estimated Yield Stress;Palmgren Miner Rule;Drop Impact;Assembly Size;Principal Coordinate;Drop Tests